Rogers AD300D 2-Layer 40mil Low-Loss PTFE PCB with EPIG Nickel-Free Finish
1.Introduction of Core
AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials designed to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. They are specifically engineered and manufactured to meet the demands of today's wireless antenna markets. This PTFE resin based material is compatible with standard PTFE fabrication and provides a cost-effective construction to improve electrical and mechanical performance.
2.Key Features
Dielectric Constant of DK 2.94 at 10GHz/23°C
Dissipation Factor of 0.0021 at 10GHz/23°C
Coefficient of Thermal Expansion: 24 ppm/°C (X-axis), 23 ppm/°C (Y-axis), and 98 ppm/°C (Z-axis) within -55 to 288°C
Thermal coefficient of dielectric constant: -73 ppm/°C
UL 94 V-0 flame retardant rating
3.Benefits
Low loss tangent (<0.002 at 10 GHz) for excellent circuit performance in all typical wireless frequency bands
Controlled dielectric constant (±0.05) for repeatable circuit performance
Very low PIM (-159 dBc at 30 mil, 1900 MHz) for excellent antenna performance and reduced yield loss due to PIM related issues
Excellent dimensional stability for repeatable circuit performance and improved manufacturing yields
Compatible with standard PTFE fabrication processes
Cost-effective construction with enhanced electrical and mechanical performance

4.PCB Construction Details
| Specification |
Value |
| Base Material | AD300D |
| Layer Count | Double sided |
| Board Dimensions | 67mm × 102.6mm (±0.15mm) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 1.2mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | EPIG (Nickel-free) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 μm
AD300D Core – 1.016 mm (40mil)
Copper layer 2 – 35 μm
6.PCB Statistics:
Components: 15
Total Pads: 41
Thru Hole Pads: 29
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 36
Nets: 2
7.Typical Applications
Cellular infrastructure base station antenna
Automotive telematics antenna systems
Commercial satellite radio antenna
8.Quality Assurance
Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide
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